|
|
|
|
Moldable Void-Fill with Superior Blocking and Bracing The PAD LOC™ product was developed by RAPAC and Storopack to meet the needs of the market. The special, patented product is designed to provide the benefits of the low cost and light weight of "peanuts", while providing extra protection and benefits associated with air cellular packaging material, air cushioning material, PE foam and foam-in-place.
|
|
![]() |
|
|
|
|
|
|
|
|
| |
This site, all images, copies, and products are Copyright© 2000, Ring Corporation and RAPAC Inc. All rights reserved. Any duplication or reuse without prior, express written permission is strictly prohibited. If you have any questions, comments, or concerns about this site, please contact our Webmaster. | |